Fujikura Limited

Sony Corporation

Hideyuki Wada

Masami Suzuki

Yuji Takaoka

Yoshimichi Harada

Yoshihiro Nabe

Tatsuo Suemasu

Masanobu Saruta

Shinichi Sakamoto

Kenichi Nakatate

Kohei Matsumaru

Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery () of a multilayer substrate (), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.

Multilayer substrate, multilayer substrate array, and transmission/ reception module

A high gain of an antenna is achieved while suppressing interference of a radio wave from an RFIC. A plurality of serial-type radiation element rowsare arranged in parallel. A parallel feed linebranches from a feed terminal of an electronic component, and connects radiation elements, at ends of the serial-type radiation element rowfarthest from the electronic component, to the feed terminal of the electronic component. All of the serial-type radiation element rows have an identical path length, along the parallel feed line, from each of the radiation elementsat the ends farthest from the electronic componentto the feed terminal of the electronic component. An amplifieris connected to the parallel feed line on a halfway portion of the parallel feed line. The amplifieramplifies a signal passing through the parallel feed line

Wireless module

The present disclosure describes increasing a maximum angle of incidence and a maximum angle of output, of an optical element package, with respect to an optical element contained therein, the optical element being reflective. A sealing resin () is filled into a gap between an LCOS element () and a package housing (). The sealing resin () covers side surfaces () and a rear surface () of the LCOS element ().

Optical element package

An optical device includes a window glass plate with which a window of a lid section is provided and which is connected to the lid section via a solder layer so that an internal space of the optical device is hermetically sealed. The solder layer has a void which is isolated from an external space and an internal space of the optical device.

Optical device and method for manufacturing optical device

An optical device includes a housing part that includes an open window disposed inside the housing part, an optical element into which light enters via the window, and a window glass plate that blocks the window. The window glass plate includes a light-transmissive base material and a metal coating film provided on an outer peripheral part of the light-transmissive base material. The window glass plate is fixed to the housing part with a solder layer provided between the metal coating film and the housing part. The housing part includes an edge part located toward the window, and the edge part includes an overhanging part that protrudes further than an inner peripheral-side edge part of the metal coating film in a direction toward a center part of the window.

Optical device

An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a three-dimensional wiring base in which a mount surface is provided on a molded product. The mount surface has two opposed apexes which sandwich a central portion therebetween and is molded so that the distance between the two apexes is the longest in distances between two points on sides of the mount surface, a cross section parallel to the mount surface of the three-dimensional wiring base is equal to the mount surface or smaller than the mount surface, and the distance between two points that is the longest in distances on sides of a shape in a plan view of the solid-state image sensing device is equal to or shorter than the distance between the two apexes.

Imaging module, insulating-tube-attached imaging module, lens-attached imaging module, and endoscope

A semiconductor apparatus having a through-hole interconnection in a semiconductor substrate. An insulating layer is formed on the semiconductor substrate. A via hole is formed through the semiconductor substrate and the insulating layer. The through-hole interconnection has another insulating layer formed in the via hole and a conductive layer formed thereon. The insulating layer formed in the via hole is formed such as to substantially planarize an inner surface of the via hole.

Semiconductor apparatus having a through-hole interconnection

A method for manufacturing a semiconductor apparatus having a through-hole interconnection in a semiconductor substrate. An insulating layer is formed on the semiconductor substrate. A via hole is formed through the semiconductor substrate and the insulating layer. Another insulating layer is formed in the via hole, and a conductive layer of the through-hole interconnection is subsequently formed. The insulating layer formed in the via hole is formed such as to substantially planarize an inner surface of the via hole.

Growing community of inventors

Chiba, Japan

Hideyuki Wada