The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Apr. 04, 2018
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventor:
Hideyuki Wada, Sakura, JP;
Assignee:
FUJIKURA LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H01Q 1/38 (2006.01); H01Q 23/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H01Q 1/38 (2013.01); H01Q 23/00 (2013.01); H05K 1/0218 (2013.01); H05K 3/4626 (2013.01);
Abstract
Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery () of a multilayer substrate (), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.