Hideyuki Tsujimura

Title: Innovations of Hideyuki Tsujimura

Introduction

Hideyuki Tsujimura is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor packaging and electronic components. With a total of 3 patents to his name, Tsujimura's work has had a considerable impact on technology.

Latest Patents

One of his latest patents is focused on a mounting structure of semiconductor package components and the manufacturing method associated with it. This patent outlines a method that includes applying a first adhesive with specific viscosity and thixotropy index on a substrate, followed by the application of a second adhesive. The process culminates in a reflow process that solidifies both adhesives, ensuring a robust mounting structure. Another significant patent involves an electronic component packaging structure that features a two-layer moisture-proof coating. This innovative design includes a circuit board and electronic components, with a moisture-proof coating layer that enhances the durability of the components.

Career Highlights

Tsujimura is currently employed at Panasonic Corporation, where he continues to develop cutting-edge technologies. His work at Panasonic has allowed him to explore various aspects of semiconductor packaging and electronic component design.

Collaborations

Throughout his career, Tsujimura has collaborated with talented individuals such as Atsushi Yamaguchi and Hidenori Miyakawa. These collaborations have contributed to the advancement of his projects and innovations.

Conclusion

Hideyuki Tsujimura's contributions to the field of semiconductor packaging and electronic components are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology.