The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
May. 22, 2012
Atsushi Yamaguchi, Osaka, JP;
Hideyuki Tsujimura, Kyoto, JP;
Hiroe Kowada, Osaka, JP;
Ryo Kuwabara, Osaka, JP;
Naomichi Ohashi, Hyogo, JP;
Atsushi Yamaguchi, Osaka, JP;
Hideyuki Tsujimura, Kyoto, JP;
Hiroe Kowada, Osaka, JP;
Ryo Kuwabara, Osaka, JP;
Naomichi Ohashi, Hyogo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity ηand a thixotropy index Tat a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity ηand a thixotropy index Tso that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η≦300 (Pa·s) and 3≦T≦T≦7, and sectional area Sof the first adhesive part and sectional area Sof the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S≦S