Hiroe Kowada

Title: Hiroe Kowada: Innovator in Semiconductor Packaging

Introduction

Hiroe Kowada is a notable inventor based in Osaka, Japan. She has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. Her innovative work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

Kowada's latest patents include a package structure and a method for manufacturing the same. This package structure features an electronic component mounted on a circuit board with a bonding metal. The flux used in this structure contains a compound with a hydroxyl group, which remains on the surface of the bonding metal. The coating resin comprises 10% to 50% by weight of isocyanate, allowing for water and moisture resistance without the need for cleaning the flux. Additionally, the coating resin can be easily peeled off at a temperature not lower than the glass transition point of the flux.

Another significant patent involves a manufacturing method for a mounting structure of a semiconductor package component. This method includes applying a first adhesive with specific viscosity and thixotropy index on the substrate, followed by a second adhesive that contacts the outer periphery of the semiconductor package component. The process culminates in a reflow process that solidifies both adhesives, ensuring a robust mounting structure.

Career Highlights

Kowada has built her career at Panasonic Corporation, where she has been instrumental in advancing semiconductor packaging technologies. Her work has not only contributed to the company's innovation portfolio but has also set new standards in the industry.

Collaborations

Throughout her career, Kowada has collaborated with esteemed colleagues, including Atsushi Yamaguchi and Koso Matsuno. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hiroe Kowada's contributions to semiconductor packaging exemplify her innovative spirit and dedication to advancing technology. Her patents reflect a commitment to improving the reliability of electronic components, making her a key figure in the field.