Panasonic Corporation

Hiroe Kowada

Atsushi Yamaguchi

Koso Matsuno

Ryo Kuwabara

Hideyuki Tsujimura

Hidenori Miyakawa

Kimiaki Nakaya

Naomichi Ohashi

A package structure including an electronic componentmounted on a circuit boardwith a bonding metal, wherein a fluxcontains a compound having a hydroxyl group and remains on the surface of the bonding metal, a coating resincontains 10% to 50% by weight of isocyanate, and a reactantof the coating resinand the fluxis formed at an interface between the fluxand the coating resin. Water resistance and moisture resistance can be obtained without cleaning the flux. The coating resincan be easily peeled off at a temperature not lower than the glass transition point temperature of the flux

Package structure, method for manufacturing same, and method for repairing package structure

A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity &#x3b7;and a thixotropy index Tat a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity &#x3b7;and a thixotropy index Tso that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30&#x2266;&#x3b7;&#x2266;300 (Pa&#xb7;s) and 3&#x2266;T&#x2266;T&#x2266;7, and sectional area Sof the first adhesive part and sectional area Sof the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S&#x2266;S

Mounting structure of semiconductor package component and manufacturing method therefor

An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same

A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.

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Osaka, Japan

Hiroe Kowada