The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jul. 01, 2009
Hideyuki Tsujimura, Kyoto, JP;
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Hiroe Kowada, Osaka, JP;
Koso Matsuno, Osaka, JP;
Hideyuki Tsujimura, Kyoto, JP;
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Hiroe Kowada, Osaka, JP;
Koso Matsuno, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.