The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Aug. 05, 2009
Atsushi Yamaguchi, Osaka, JP;
Koso Matsuno, Osaka, JP;
Ryo Kuwabara, Osaka, JP;
Hiroe Kowada, Osaka, JP;
Kimiaki Nakaya, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Koso Matsuno, Osaka, JP;
Ryo Kuwabara, Osaka, JP;
Hiroe Kowada, Osaka, JP;
Kimiaki Nakaya, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.