Panasonic Corporation

Hideyuki Tsujimura

Atsushi Yamaguchi

Hidenori Miyakawa

Koso Matsuno

Hiroe Kowada

Naomichi Ohashi

Takayuki Higuchi

Ryo Kuwabara

A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity &#x3b7;and a thixotropy index Tat a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity &#x3b7;and a thixotropy index Tso that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30&#x2266;&#x3b7;&#x2266;300 (Pa&#xb7;s) and 3&#x2266;T&#x2266;T&#x2266;7, and sectional area Sof the first adhesive part and sectional area Sof the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S&#x2266;S

Mounting structure of semiconductor package component and manufacturing method therefor

An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same

The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

Electrically conductive adhesive

Growing community of inventors

Kyoto, Japan

Hideyuki Tsujimura