The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Oct. 31, 2006
Atsushi Yamaguchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Takayuki Higuchi, Osaka, JP;
Koso Matsuno, Osaka, JP;
Hideyuki Tsujimura, Kyoto, JP;
Atsushi Yamaguchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Takayuki Higuchi, Osaka, JP;
Koso Matsuno, Osaka, JP;
Hideyuki Tsujimura, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.