Tokyo, Japan

Hideyuki Seike

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2014-2019

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10 patents (USPTO):Explore Patents

Title: Innovations by Hideyuki Seike in Semiconductor Technology

Introduction

Hideyuki Seike is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on methods for producing semiconductor chips and packages, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is a method for producing a semiconductor chip. This method involves creating a semiconductor chip that includes a substrate, a conductive portion formed on the substrate, and a microbump on the conductive portion. The process includes a smooth surface formation that involves heating a reducing gas in an inert atmosphere, ensuring the microbump reaches its melting point. Additionally, a pressure application member is used to maintain a flat surface contact with the microbump during this process.

Another notable patent is a method for producing a semiconductor package. This method allows for the lamination of multiple semiconductor chips, each containing a substrate, conductive portions, and microbumps. Similar to the chip production method, this process also involves heating a reducing gas in an inert atmosphere to achieve the necessary conditions for the microbumps.

Career Highlights

Hideyuki Seike is currently employed at TDK Corporation, where he continues to innovate in semiconductor technology. His expertise and inventions have played a vital role in advancing the capabilities of semiconductor devices.

Collaborations

Throughout his career, Seike has collaborated with notable colleagues, including Makoto Orikasa and Yuhei Horikawa. These collaborations have further enhanced the development of innovative semiconductor solutions.

Conclusion

Hideyuki Seike's contributions to semiconductor technology through his patents and collaborations highlight his importance in the field. His innovative methods for producing semiconductor chips and packages are paving the way for advancements in electronic devices.

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