The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Nov. 15, 2012
Tdk Corporation, Tokyo, JP;
Yuhei Horikawa, Tokyo, JP;
Shin Fujita, Tokyo, JP;
Kenichi Yoshida, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Makoto Orikasa, Tokyo, JP;
Hideyuki Seike, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is Eand the indentation elastic modulus of the intermediate layer is E, the ratio of Eto Eis equal to or more than 0.8 and equal to or less than 1.5.