The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Aug. 06, 2013
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kenichi Yoshida, Tokyo, JP;

Makoto Orikasa, Tokyo, JP;

Hideyuki Seike, Tokyo, JP;

Yuhei Horikawa, Tokyo, JP;

Hisayuki Abe, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13111 (2013.01); H01L 2924/00014 (2013.01);
Abstract

The present invention relates to a terminal structure comprising; a base material; an external electrodeformed on the base material; an insulating coating layerformed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layerfilling the opening and covering part of the insulating coating layer; and a dome-shaped bumpcovering the under-bump metal layer, wherein in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the bump, and the thickness Tof the under-bump metal layer at a center of the opening is equal to or greater than the thickness Tof the under-bump metal layer at an end portion of the opening.


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