Hideo Eto

USPTO Granted Patents = 18 (Patent Applications = 6)

EPO Patents = 2

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 71(Granted Patents)

Location History:

Kanagawa, JP (2005 - 2006)
Yokohama, JP (2004 - 2010)
Mie, JP (2014 - 2019)
Yokkaichi, JP (2016 - 2022)

Company Filing History:

13 out of 52,711

Kabushiki Kaisha Toshiba

patents

3 out of 2,955

Toshiba Memory Corporation

patents

1 out of 6

Hokuriku Seikei Industrial Co., Ltd.

Years Active: 2004-2022

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18 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11482443 - Bonding apparatus and bonding method (2022-10-25),

2. 11094574 - Substrate supporting device and plasma processing apparatus (2021-08-17),

3. 10818535 - Plasma processing-apparatus processing object support platform, plasma processing apparatus, and plasma processing method (2020-10-27),

4. 10280121 - Silicon carbide member for plasma processing apparatus (2019-05-07),

5. 10115615 - Substrate processing apparatus and control method of substrate processing apparatus (2018-10-30),

6. 9370920 - Electrostatic chuck, mount plate support, and manufacturing method of electrostatic chuck (2016-06-21),

7. 9236229 - Gas supply member, plasma treatment method, and method of forming yttria-containing film (2016-01-12),

8. 9111969 - Seal member, etching apparatus, and a method of manufacturing a semiconductor device (2015-08-18),

9. 8833388 - Pressure controlling apparatus (2014-09-16),

10. 8760053 - Power supply control device, plasma processing device, and plasma processing method (2014-06-24),

11. 8689623 - Flow sensor, mass flow controller, and method for manufacturing flow sensor (2014-04-08),

12. 8651135 - Mass flow controller, mass flow controller system, substrate processing device, and gas flow rate adjusting method (2014-02-18),

13. 7678567 - Optical biosensor (2010-03-16),

14. 7498145 - Concentration measuring method, concentration measuring kit, and sensor chip for use in the method (2009-03-03),

15. 7410614 - Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip (2008-08-12),

Title: The Innovative Mind of Hideo Eto: Pioneering Bonding Technologies and Plasma Processing Solutions

Introduction: Hideo Eto, a prolific inventor from Mie, JP, has made significant contributions to the field of technology with a total of 18 patents under his name. His groundbreaking work in bonding apparatus and plasma processing has revolutionized the way we approach substrate bonding and processing techniques.

Latest Patents: Among his latest patents is the "Bonding Apparatus and Bonding Method," which features a unique bonding apparatus with first and second holders for effectively bonding substrates. Additionally, the "Substrate Supporting Device and Plasma Processing Apparatus" showcases his expertise in developing innovative solutions for substrate support within plasma processing systems.

Career Highlights: Throughout his career, Hideo Eto has had the privilege of working with esteemed companies such as Toshiba and Toshiba Memory Corporation. His invaluable contributions have played a crucial role in advancing technological developments within these renowned organizations.

Collaborations: Hideo Eto's collaborative efforts with esteemed coworkers like Makoto Saito and Ichiro Tono have further enriched his innovative projects. Together, they have pushed the boundaries of technological advancements and shared knowledge to propel the industry forward.

Conclusion: In conclusion, Hideo Eto stands as a trailblazer in the realm of technology, with a diverse portfolio of patents and a reputation for pioneering innovative solutions in bonding apparatus and plasma processing. His dedication to advancing technological frontiers continues to inspire future generations of inventors and engineers.

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6 patents pending:

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2 patents (EPO):

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