The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Sep. 02, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Hideo Eto, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/673 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/673 (2013.01); H01L 21/68721 (2013.01); H01L 21/67092 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A bonding apparatus according to the present embodiment includes a first holder and a second holder. The first holder holds a first substrate. The second holder sucks a second substrate, opposes the second substrate to the first substrate, and bonds the second substrate to the first substrate. A first ring stage is provided on an outer circumference of the first holder and allows a first ring member provided on an outer edge of the first substrate to be mounted thereon. A second ring stage is provided on an outer circumference of the second holder and allows a second ring member provided on an outer edge of the second substrate to be mounted thereon. A first heater is provided in the first ring stage. A second heater is provided in the second ring stage.


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