Company Filing History:
5 out of 3,781 
2 out of 7,529 
Years Active: 2007-2013
Title: **Hidemasa Kagii: Pioneer in Semiconductor Innovation**
Introduction
Hidemasa Kagii, an innovative inventor based in Takasaki, Japan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 7 patents, his work exemplifies creativity and advancement in material science and engineering. His latest inventions focus on enhancing the reliability and performance of semiconductor devices.
Latest Patents
Among Hidemasa Kagii’s notable patents is his work on a semiconductor device and method of manufacturing the same. This innovation involves a structure where a silicon (Si) chip is bonded to a metal leadframe via a porous joint layer composed of high conductive metal. Utilizing silver (Ag) as the bonding material, the joint layer features a three-dimensional network structure. Furthermore, a film containing zinc oxide or aluminum oxide is formed on the surface of the semiconductor assembly that contacts a polymer resin. This design reduces thermal stress load on the Si chip and improves the fatigue life of the joint layer. Additionally, the adhesion of the polymer resin to the film is enhanced through an anchor effect, which helps prevent cracks in the bonding portion, ultimately leading to a highly reliable lead-free semiconductor device.
Career Highlights
Hidemasa Kagii's career includes significant roles at prominent companies, such as Renesas Technology Corporation and Renesas Electronics Corporation. His work at these organizations has allowed him to push the boundaries of semiconductor manufacturing processes and contribute to advancements that benefit the electronics industry.
Collaborations
Throughout his career, Hidemasa has had the opportunity to collaborate with esteemed professionals in his field, including Katsuo Arai and Hiroyuki Nakamura. These collaborations have aided in enhancing his research and development efforts, fostering a creative environment that encourages innovation in semiconductor technology.
Conclusion
Hidemasa Kagii stands out as a leading inventor in the semiconductor industry, with his patents reflecting a deep understanding of materials and their applications. His contributions not only improve the performance and reliability of semiconductor devices but also pave the way for future innovations in technology. Through his dedication and collaborative efforts, Kagii continues to inspire aspiring inventors and engineers around the world.