The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Apr. 13, 2007
Hidemasa Kagii, Takasaki, JP;
Akira Muto, Haruna, JP;
Ichio Shimizu, Tamamura, JP;
Katsuo Arai, Takasaki, JP;
Hiroshi Sato, Takasaki, JP;
Hiroyuki Nakamura, Maebashi, JP;
Masahiko Osaka, Yuki, JP;
Takuya Nakajo, Numata, JP;
Keiichi Okawa, Takasaki, JP;
Hiroi Oka, Tamamura, JP;
Hidemasa Kagii, Takasaki, JP;
Akira Muto, Haruna, JP;
Ichio Shimizu, Tamamura, JP;
Katsuo Arai, Takasaki, JP;
Hiroshi Sato, Takasaki, JP;
Hiroyuki Nakamura, Maebashi, JP;
Masahiko Osaka, Yuki, JP;
Takuya Nakajo, Numata, JP;
Keiichi Okawa, Takasaki, JP;
Hiroi Oka, Tamamura, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminalsG,S via connection materials. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminalsG,S being exposed. Mounting surfaces of the metal plate terminalsG,S and a third part of the metal cap are bonded to electrodes on a mounting boardvia connection materialsand