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Hideki Mizuhara

USPTO Granted Patents = 48 (Patent Applications = 2)

Average Co-Inventor Count = 3.4

ph-index = 9

Forward Citations = 322(Granted Patents)

Location History:

Hashima, JP (2001)
Bisai, JP (1999 - 2011)
Ichinomiya, JP (2010 - 2012)
Aichi, JP (1999 - 2013)
Moriguchi, JP (2013)

Company Filing History:

48 out of 8,781

Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Kanto Sanyo Semiconductor Co., Ltd.

where one patent can have more than one assignee

Years Active: 1999-2013

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Areas of Expertise:

Semiconductor Modules

Circuit Boards

Solder Structures

Lighting Devices

Device Mounting Boards

Circuit Devices

Stacked Semiconductor Chips

Insulation Films

Conductive Foils

Dual Damascene Structures

Contamination Reduction

Fabrication Methods

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8378229 - Circuit board and method for manufacturing semiconductor modules and circuit boards (2013-02-19),

2. 8344522 - Solder structure, method for forming the solder structure, and semiconductor module including the solder structure (2013-01-01),

3. 8338946 - Semiconductor module, method of manufacturing semiconductor module, and mobile device (2012-12-25),

4. 8283681 - Lighting device and method of manufacturing the same (2012-10-09),

5. 8183090 - Methods for manufacturing device mounting board and circuit substrate (2012-05-22),

6. 8093699 - Circuit device with circuit board and semiconductor chip mounted thereon (2012-01-10),

7. 8022533 - Circuit apparatus provided with asperities on substrate surface (2011-09-20),

8. 7969005 - Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor (2011-06-28),

9. 7939373 - Manufacturing method for semiconductor device containing stacked semiconductor chips (2011-05-10),

10. 7855452 - Semiconductor module, method of manufacturing semiconductor module, and mobile device (2010-12-21),

11. 7854062 - Method for manufacturing circuit device (2010-12-21),

12. 7851921 - Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board (2010-12-14),

13. 7808114 - Circuit device and method of manufacturing thereof (2010-10-05),

14. 7768132 - Circuit device and manufacturing method thereof (2010-08-03),

15. 7759581 - Circuit board and method for manufacturing semiconductor modules and circuit boards (2010-07-20),

Title: Hideki Mizuhara: Pioneering Inventor from Aichi, JP

Introduction: Hideki Mizuhara is a renowned inventor hailing from Aichi, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Mizuhara's latest patents include cutting-edge advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: With a career spanning over two decades, Hideki Mizuhara has established himself as a leading figure in the world of innovation. His work has not only revolutionized industries but has also inspired a new generation of inventors to think outside the box.

Collaborations: Throughout his career, Mizuhara has collaborated with top research institutions, universities, and tech companies to bring his ideas to life. His ability to work across disciplines and industries has led to the creation of truly transformative technologies.

Conclusion: Hideki Mizuhara's passion for innovation, coupled with his relentless drive to solve complex problems, has solidified his position as a trailblazer in the world of inventions. His work continues to shape the future of technology and inspire others to pursue their own creative endeavors.

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