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For the Inventor, By the Inventor

Aichi, Japan

Hideki Mizuhara

USPTO Granted Patents = 48 

Average Co-Inventor Count = 3.4

ph-index = 9

Forward Citations = 322(Granted Patents)


Location History:

  • Hashima, JP (2001)
  • Bisai, JP (1999 - 2011)
  • Ichinomiya, JP (2010 - 2012)
  • Aichi, JP (1999 - 2013)
  • Moriguchi, JP (2013)

Company Filing History:

goldMedal48 out of 8,776 
 
Sanyo Electric Co., Ltd.
 patents
silverMedal6 out of 39 
 
Kanto Sanyo Semiconductors Co., Ltd.
 patents
bronzeMedal1 out of 306 
 
Sanyo Semiconductor Co., Ltd.
 patents
4. 1 out of 6 
 
Kanto Sanyo Semiconductor Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1999-2013

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48 patents (USPTO):
1. 8378229 - Circuit board and method for manufacturing semiconductor modules and circuit boards (2013-02-19),
2. 8344522 - Solder structure, method for forming the solder structure, and semiconductor module including the solder structure (2013-01-01),
3. 8338946 - Semiconductor module, method of manufacturing semiconductor module, and mobile device (2012-12-25),
4. 8283681 - Lighting device and method of manufacturing the same (2012-10-09),
5. 8183090 - Methods for manufacturing device mounting board and circuit substrate (2012-05-22),
6. 8093699 - Circuit device with circuit board and semiconductor chip mounted thereon (2012-01-10),
7. 8022533 - Circuit apparatus provided with asperities on substrate surface (2011-09-20),
8. 7969005 - Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor (2011-06-28),
9. 7939373 - Manufacturing method for semiconductor device containing stacked semiconductor chips (2011-05-10),
10. 7855452 - Semiconductor module, method of manufacturing semiconductor module, and mobile device (2010-12-21),
11. 7854062 - Method for manufacturing circuit device (2010-12-21),
12. 7851921 - Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board (2010-12-14),
13. 7808114 - Circuit device and method of manufacturing thereof (2010-10-05),
14. 7768132 - Circuit device and manufacturing method thereof (2010-08-03),
15. 7759581 - Circuit board and method for manufacturing semiconductor modules and circuit boards (2010-07-20),

Title: Hideki Mizuhara: Pioneering Inventor from Aichi, JP

Introduction: Hideki Mizuhara is a renowned inventor hailing from Aichi, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Mizuhara's latest patents include cutting-edge advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: With a career spanning over two decades, Hideki Mizuhara has established himself as a leading figure in the world of innovation. His work has not only revolutionized industries but has also inspired a new generation of inventors to think outside the box.

Collaborations: Throughout his career, Mizuhara has collaborated with top research institutions, universities, and tech companies to bring his ideas to life. His ability to work across disciplines and industries has led to the creation of truly transformative technologies.

Conclusion: Hideki Mizuhara's passion for innovation, coupled with his relentless drive to solve complex problems, has solidified his position as a trailblazer in the world of inventions. His work continues to shape the future of technology and inspire others to pursue their own creative endeavors.

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