Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Kanto Sanyo Semiconductor Co., Ltd.

Hideki Mizuhara

Ryosuke Usui

Yasunori Inoue

Yusuke Igarashi

Hiroyuki Watanabe

Noriaki Sakamoto

Mayumi Nakasato

Takeshi Nakamura

Naoteru Matsubara

Kaori Misawa

Masaki Hirase

Hiroyuki Aoe

Sadamichi Takakusaki

Shinichi Tanimoto

Takaya Kusabe

Yoshio Okayama

Tetsuya Yamamoto

Yasuyuki Yanase

Noriaki Kojima

Kiyoshi Shibata

Nobuhisa Takakusaki

Atsuhiro Nishida

Masurao Yoshii

Yasuhiro Kohara

Yoshikazu Yamaoka

Hajime Kobayashi

Naoki Tanahashi

Takashi Goto

Masahiko Mizutani

Toshiya Shimizu

Hidetaka Nishimura

Kimihide Saito

Tsuyoshi Hasegawa

Hiroyasu Ishihara

Ryosuke Usul

Yoshinari Sakuma

Katsunori Kobayashi

Hayato Abe

A circuit board includes a substrate made principally of metal. An opening is provided on the substrate. A first wiring layer is provided on one surface of the substrate via a first insulating layer, and a second wiring layer is provided on the other surface of the substrate via a second insulating layer. A conductor penetrates the substrate via the opening and connects the first wiring layer with the second wiring layer. An end of the opening at one surface side of the substrate has a tapering form on a surface layer thereof, and the first insulating layer has a recess on an upper surface thereof in an upper region of the opening.

Circuit board and method for manufacturing semiconductor modules and circuit boards

The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 &#x3bc;m.

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

Semiconductor module, method of manufacturing semiconductor module, and mobile device

A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.

Lighting device and method of manufacturing the same

To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Methods for manufacturing device mounting board and circuit substrate

A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.

Circuit device with circuit board and semiconductor chip mounted thereon

Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10 &#x3bc;m. This produces an anchoring effect occurs between the substrate and the insulating film, thereby improving the adhesiveness between the substrate and the insulating resin film.

Circuit apparatus provided with asperities on substrate surface

A method for manufacturing a semiconductor module includes: a first process of forming a conductor on one face of an insulating layer; a second process of exposing the conductor from the other face of the insulating layer; a third process of providing a first wiring layer on an exposed area of the conductor and on the other face of the insulating layer; a fourth process of preparing a substrate on which a circuit element is formed, the second wiring being formed on the substrate; and a fifth process of embedding the conductor in the insulating layer by press-bonding the insulating layer and the substrate in a state where the conductor on which the first wiring layer is provided by the third process is disposed counter to the second wiring layer. Wiring is formed without causing damaging to the circuit element.

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.

Manufacturing method for semiconductor device containing stacked semiconductor chips

A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

Method for manufacturing circuit device

Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board

A circuit device of preferred embodiments of the present invention includes: a circuit element with electrodes formed in a peripheral part thereof; connecting portions connected to surfaces of the electrodes; and redistribution lines which are continuous to the respective connecting portions and extended in parallel to the main surface of the circuit element. In preferred embodiments of the present invention, the connecting portions and the redistribution lines are integrally formed of one piece of metal. Accordingly, there is no place where different materials are connected in a portion between the connecting portions and the redistribution lines, thus improving a joint reliability of the entire device against a thermal stress or the like.

Circuit device and method of manufacturing thereof

A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.

Circuit device and manufacturing method thereof

A circuit board is provided with a metal plate, having openings, as core material. The opening gradually increases from a lower surface side toward an upper surface side of the metal plate. On both surface sides of the metal plate there are provided wiring patterns, respectively, via insulating layers. The insulating layer on an upper region of the opening and the corresponding wiring pattern are provided have a recess on the upper surface. To electrically connect each wiring pattern, the circuit board includes a conductor that penetrates the metal plate via the opening and which connects the wiring patterns with each other. An LSI chip is directly coupled to the upper surface side of the metal plate via a solder ball.

Growing community of inventors

Aichi, Japan

Hideki Mizuhara