The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Dec. 22, 2005
Yasuhiro Kohara, Gifu, JP;
Ryosuke Usui, Ichinomiya, JP;
Hideki Mizuhara, Ichinomiya, JP;
Yasunori Inoue, Ogaki, JP;
Yasuhiro Kohara, Gifu, JP;
Ryosuke Usui, Ichinomiya, JP;
Hideki Mizuhara, Ichinomiya, JP;
Yasunori Inoue, Ogaki, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.