The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Apr. 25, 2008
Mayumi Nakasato, Ogaki, JP;
Hideki Mizuhara, Ichinomiya, JP;
Mayumi Nakasato, Ogaki, JP;
Hideki Mizuhara, Ichinomiya, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A method for manufacturing a semiconductor module includes: a first process of forming a conductor on one face of an insulating layer; a second process of exposing the conductor from the other face of the insulating layer; a third process of providing a first wiring layer on an exposed area of the conductor and on the other face of the insulating layer; a fourth process of preparing a substrate on which a circuit element is formed, the second wiring being formed on the substrate; and a fifth process of embedding the conductor in the insulating layer by press-bonding the insulating layer and the substrate in a state where the conductor on which the first wiring layer is provided by the third process is disposed counter to the second wiring layer. Wiring is formed without causing damaging to the circuit element.