Location History:
- Kyoto, JP (2017)
- Yasu, JP (2017 - 2018)
Company Filing History:
Years Active: 2017-2018
Title: Innovations of Hideki Matsushita
Introduction
Hideki Matsushita is a notable inventor based in Yasu, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced materials and manufacturing methods that enhance device performance.
Latest Patents
One of Matsushita's latest patents is for a composite substrate and method for manufacturing the same. This invention involves a composite substrate that includes a monocrystalline support substrate made of an insulating material, along with a monocrystalline semiconductor part layered on its upper surface. The interface region between these components is meticulously designed to include specific metals and inert elements, optimizing the substrate's functionality.
Another significant patent is related to a method of manufacturing a device. This method controls the metal content at the joining interface of two substrates. It involves activating the surfaces of the substrates using a FAB gun, discharging multiple metals to create a joining interface, and performing a heating step to ensure proper bonding. This innovative approach allows for precise control over the materials used in semiconductor devices.
Career Highlights
Matsushita is currently associated with Kyocera Corporation, a leading company in the field of electronics and ceramics. His work at Kyocera has been instrumental in advancing the company's technological capabilities and product offerings.
Collaborations
Matsushita has collaborated with notable coworkers such as Masanobu Kitada and Tetsuhiro Osaki. Their combined expertise has contributed to the successful development of innovative technologies in their field.
Conclusion
Hideki Matsushita's contributions to semiconductor technology through his patents and work at Kyocera Corporation highlight his role as a significant inventor in the industry. His innovative approaches continue to influence advancements in electronic materials and manufacturing processes.