The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Sep. 29, 2014
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Hideki Matsushita, Yasu, JP;
Masanobu Kitada, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/06 (2006.01); B23K 20/00 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); B23K 20/00 (2013.01); H01L 21/2007 (2013.01); H01L 29/0649 (2013.01);
Abstract
A composite substrateaccording to the present invention comprises: a supporting substratethat is formed of an insulating material; a semiconductor partthat is disposed over the supporting substrate; and interfacial inclusionsthat are present at the interface between the supporting substrateand the semiconductor partand contains Ni and Fe so that the ratio of Ni to Fe is 0.4 or more. Consequently, the present invention is able to provide a highly reliable composite substrate wherein the interfacial inclusionsare prevented from diffusing into the semiconductor part