IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Hideji Aoki

USPTO Granted Patents = 9

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Fukuoka, JP (1993 - 1997)
  • Tokyo, JP (1996 - 2003)

Company Filing History:

goldMedal6 out of 21,351 
 
Mitsubishi Denki Kabushiki Kaisha
 patents
silverMedal2 out of 177 
 
Mitsubishi Electric Engineering Company, Limited
 patents
bronzeMedal2 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1993-2003

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9 patents (USPTO):Explore Patents
1. 6530764 - Mold for resin-sealing of semiconductor devices (2003-03-11),
2. 6363976 - Semiconductor manufacturing apparatus and method of manufacturing semiconductor device (2002-04-02),
3. 6337042 - Press machine and method of manufacturing pressed products (2002-01-08),
4. 6242287 - Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin (2001-06-05),
5. 5842257 - Apparatus for and method of fabricating semiconductor devices (1998-12-01),
6. 5636127 - Method and apparatus for carrying and locating sheet frame (1997-06-03),
7. 5587633 - Press control method and press apparatus (1996-12-24),
8. 5520276 - Method and apparatus for carrying and locating sheet frame (1996-05-28),
9. 5177992 - Device for feeding thin-web frame (1993-01-12),
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