Hideji Aoki

This inventor holds 9 USPTO granted patents. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Company, Limited, Other. Active years: 1993-2003.

USPTO Granted Patents = 9

% Patents Active = 88.9

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 61(Granted Patents)

Location History:

Fukuoka, JP (1993 - 1997)
Tokyo, JP (1996 - 2003)

Company Filing History:

6 out of 21,351

Mitsubishi Denki Kabushiki Kaisha

patents

2 out of 177

Mitsubishi Electric Engineering Company, Limited

patents

2 out of 834,350

Other

patents

where one patent can have more than one assignee

Years Active: 1993-2003

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6530764 - Mold for resin-sealing of semiconductor devices (2003-03-11),

2. 6363976 - Semiconductor manufacturing apparatus and method of manufacturing semiconductor device (2002-04-02),

3. 6337042 - Press machine and method of manufacturing pressed products (2002-01-08),

4. 6242287 - Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin (2001-06-05),

5. 5842257 - Apparatus for and method of fabricating semiconductor devices (1998-12-01),

6. 5636127 - Method and apparatus for carrying and locating sheet frame (1997-06-03),

7. 5587633 - Press control method and press apparatus (1996-12-24),

8. 5520276 - Method and apparatus for carrying and locating sheet frame (1996-05-28),

9. 5177992 - Device for feeding thin-web frame (1993-01-12),

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