The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Feb. 02, 2000
Abstract
A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver ( ) and a vertical driver ( ) are controlled to move a punch holder ( ), or an end portion ( T ) of a punch ( ), within a plane defined by first and second directions (D , D ). A tip ( A) of the punch ( ) is brought into contact with leads ( ), with a punch-side forming surface ( S) and a die-side forming surface ( S) maintained in parallel relationship. A pressurizer ( ) is controlled to move the end portion ( T ) in a fourth direction (D ) toward the die-side forming surface ( S), and the punch-side forming surface ( S) and the die-side forming surface ( S) hold the leads ( ) therebetween. A pressure detector ( ) detects a load placed upon the punch ( ). A controller ( ) receives a detection signal (S ) from the pressure detector ( ) and controls the pressurizer ( ) to place a predetermined load upon the lead ( ) held between the punch-side forming surface ( S) and the die-side forming surface ( S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.