The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Mar. 20, 1998
Hideji Aoki, Tokyo, JP;
Hidenori Sekiya, Tokyo, JP;
Kenichirou Katou, Tokyo, JP;
Hiromu Nishitani, Tokyo, JP;
Other;
Abstract
Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (,) includes a cavity (,) having a rectangular contour shape seen on a plane which serves to house a sealing resin (,) therein, and a remaining gate housing section (,) provided on any of four corners of the cavity (,) corresponding to a remaining gate (,) on a lower face of a corner (,) of a lead frame (,). A lower gate punch (,) is provided in a boundary portion between the cavity (,) and the remaining gate housing section (,). When the lead frame (,) is mounted on the frame receiving die (,), the sealing resin (,) is housed in the cavity (,) and the remaining gate (,) is housed in the remaining gate housing section (,).