Mitsubishi Denki Kabushiki Kaisha

Other

Mitsubishi Electric Engineering Company, Limited

Hideji Aoki

Hidetaka Yamasaki

Kazuhisa Hiroshige

Suekazu Nakashima

Takahiro Tashima

Hiromichi Yamada

Toshinobu Banjo

Hidekazu Manabe

Tetsuya Hirose

Kiyoharu Kato

Hiromu Nishitani

Kenichirou Katou

Toru Ueno

Hidenori Sekiya

Katsuhito Kamachi

Yoshiyuki Mishima

Yasuo Kawano

Yoshiyuki Osako

A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.

Mold for resin-sealing of semiconductor devices

A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver ( ) and a vertical driver ( ) are controlled to move a punch holder ( ), or an end portion ( T ) of a punch ( ), within a plane defined by first and second directions (D , D ). A tip ( A) of the punch ( ) is brought into contact with leads ( ), with a punch-side forming surface ( S) and a die-side forming surface ( S) maintained in parallel relationship. A pressurizer ( ) is controlled to move the end portion ( T ) in a fourth direction (D ) toward the die-side forming surface ( S), and the punch-side forming surface ( S) and the die-side forming surface ( S) hold the leads ( ) therebetween. A pressure detector ( ) detects a load placed upon the punch ( ). A controller ( ) receives a detection signal (S ) from the pressure detector ( ) and controls the pressurizer ( ) to place a predetermined load upon the lead ( ) held between the punch-side forming surface ( S) and the die-side forming surface ( S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

An object is to reduce mutual interference between a plurality of sets of molds coupled to a common frame stand to improve the processing accuracy. A plurality of sets (e.g. two sets) of molds are driven by servo motors ( ). The servo motors ( ) are individually controlled by servo amplifiers ( ), respectively. A control portion in the servo amplifier ( ) calculates a current (I) so that the measured value (X) of the rotating position of the servo motor ( ) follows a directing value (X ) sent from a CPU through a pulse generator ( ). A torque detecting/limiting portion ( ) limits the calculated current (I) so that a limit value of the torque sent from the CPU through a DA converter ( ) is not exceeded and sends it to the servo motor ( ) through a current amplifier ( ). When the torque of the servo motor ( ) reaches the limit value after the molds come in contact, the directing value (X ) is rapidly advanced in the mold-losing direction.

Press machine and method of manufacturing pressed products

Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (,) includes a cavity (,) having a rectangular contour shape seen on a plane which serves to house a sealing resin (,) therein, and a remaining gate housing section (,) provided on any of four corners of the cavity (,) corresponding to a remaining gate (,) on a lower face of a corner (,) of a lead frame (,). A lower gate punch (,) is provided in a boundary portion between the cavity (,) and the remaining gate housing section (,). When the lead frame (,) is mounted on the frame receiving die (,), the sealing resin (,) is housed in the cavity (,) and the remaining gate (,) is housed in the remaining gate housing section (,).

Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin

A process wherein a lead frame into which a plurality of semiconductor devices are integrated is first supplied to a press unit (21) among three press units (21 to 23) for cutting, to be cut into the respective semiconductor devices. Thereafter the lead frame is successively fed to the press units (22, 23) in the units of the semiconductor devices due to the action of an internal conveyor (33a), thereby being subjected to cutting stepwise. Thus, the press units (21 to 23) are provided at wide spaces, whereby press motors (85a to 85c) requiring high outputs are independently set for the respective press units (21 to 23). Further, the process does not vary the space between molds with the product pitch of the lead frame. Working is enabled by the press motors which are provided for the respective press units. The process copes with various types of semiconductor devices because the space between the molds may not be changed.

Apparatus for and method of fabricating semiconductor devices

In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.

Method and apparatus for carrying and locating sheet frame

It is an object to obtain a press apparatus and a press controlling method which apply press working to a processed object with accurate press load and is capable of press working with accurate press load without affected by variations in thickness of the processed objects and variations in shut height of molds. A servo motor (51) is connected concentrically to a rotation transmitter (52), and a screw shaft (53) is provided passing through the center of the rotation transmitter (52). The driving force of the servo motor (51) is converted into a thrusting force of a press ram (54) by combining the rotation transmitter (52) and the screw shaft (53). Correct press load is applied to the processed objects and troubles in the press processing caused by variations in thickness of the processed objects can be prevented.

Press control method and press apparatus

A thin-web frame feeding device for intermittently feeding a thin-web frame at a predetermined pitch along a guide rail has first and second shafts supported by bearing stands for synchronized axial sliding motion in the same direction and for rotation in opposite directions. The first and second shafts are provided with feeding claws rotatable in accordance with the rotation of the shafts into and out of positions where spontaneous portions of the thin-web frame are clamped. The feeding claws are axially moved in accordance with the axial sliding movement of the shafts to feed the thin-web frame.

Growing community of inventors

Tokyo, Japan

Hideji Aoki