The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1998
Filed:
Dec. 13, 1995
Takahiro Tashima, Tokyo, JP;
Hideji Aoki, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A process wherein a lead frame into which a plurality of semiconductor devices are integrated is first supplied to a press unit (21) among three press units (21 to 23) for cutting, to be cut into the respective semiconductor devices. Thereafter the lead frame is successively fed to the press units (22, 23) in the units of the semiconductor devices due to the action of an internal conveyor (33a), thereby being subjected to cutting stepwise. Thus, the press units (21 to 23) are provided at wide spaces, whereby press motors (85a to 85c) requiring high outputs are independently set for the respective press units (21 to 23). Further, the process does not vary the space between molds with the product pitch of the lead frame. Working is enabled by the press motors which are provided for the respective press units. The process copes with various types of semiconductor devices because the space between the molds may not be changed.