IDiyas

For the Inventor, By the Inventor

Osaka, Japan

Hideaki Ishizawa

USPTO Granted Patents = 13 

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 46(Granted Patents)


Location History:

  • Hirakata, JP (2007)
  • Kouka, JP (2016)
  • Osaka, JP (2003 - 2018)

Company Filing History:

goldMedal13 out of 877 
 
Sekisui Chemical Co., Ltd.
 patents

Years Active: 2003-2018

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13 patents (USPTO):Explore Patents
1. 9928934 - Curable composition for electronic component and connection structure (2018-03-27),
2. 9490046 - Conductive material and connected structure (2016-11-08),
3. 9446484 - Conductive particles, method for producing conductive particles, conductive material and connection structure (2016-09-20),
4. 8901207 - Adhesive for electronic components (2014-12-02),
5. 8802989 - Conductive material and connection structure (2014-08-12),
6. 8563362 - Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles (2013-10-22),
7. 8119323 - Process for producing patterned film and photosensitive resin composition (2012-02-21),
8. 7915743 - Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device (2011-03-29),
9. 7838577 - Adhesive for electronic component (2010-11-23),
10. 7262231 - Photosensitive amine generator, photocurable composition and photoreactive adhesive composition (2007-08-28),
11. 7012123 - Acrylic polymer and charge transport material (2006-03-14),
12. 6864300 - Photoreactive adhesive composition and method of bonding with the same (2005-03-08),
13. 6641912 - Photocurable pressure-sensitive adhesive composition and its sheet (2003-11-04),

Title: The Innovative Contributions of Hideaki Ishizawa

Introduction

Hideaki Ishizawa is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of electronic components, holding a total of 13 patents. His work focuses on developing advanced materials and compositions that enhance the performance and reliability of electronic devices.

Latest Patents

Ishizawa's latest patents include a curable composition for electronic components and a conductive material with a unique connection structure. The curable composition is designed to be quickly cured while maintaining increased storage stability. It consists of an epoxy compound, an anionic curing agent, a flux, and a basic compound that excludes the anionic curing agent. The conductive material features a rapid reaction rate and high fluxing effect, incorporating conductive particles with solder on their external surfaces, an anionically hardenable compound, an anionic hardener, and an organic acid with a carboxyl group.

Career Highlights

Ishizawa is currently employed at Sekisui Chemical Co., Ltd., where he continues to innovate and develop new technologies. His work has significantly impacted the electronic component industry, leading to advancements in product performance and reliability.

Collaborations

Throughout his career, Ishizawa has collaborated with notable colleagues, including Akinobu Hayakawa and Ryohei Masui. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Hideaki Ishizawa's contributions to the field of electronic components exemplify the spirit of innovation. His patents and ongoing work at Sekisui Chemical Co., Ltd. continue to shape the future of technology in this industry.

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