The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
May. 20, 2014
Applicant:
Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;
Inventors:
Hideaki Ishizawa, Kouka, JP;
Takashi Kubota, Kouka, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H05K 1/09 (2006.01); C08L 63/00 (2006.01); C08L 101/02 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01); C08J 3/12 (2006.01); B22F 1/02 (2006.01); H05K 3/36 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/025 (2013.01); C08J 3/128 (2013.01); C08L 63/00 (2013.01); C08L 101/02 (2013.01); H01L 24/80 (2013.01); H05K 1/09 (2013.01); H05K 3/323 (2013.01); H05K 3/3457 (2013.01); B22F 1/0062 (2013.01); B22F 1/02 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15788 (2013.01); H05K 3/3436 (2013.01); H05K 3/363 (2013.01); H05K 2201/0221 (2013.01);
Abstract
There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.