Sekisui Chemical Co., Ltd.

Hideaki Ishizawa

Akinobu Hayakawa

Takashi Kubota

Ryohei Masui

Kohei Takeda

Hiroji Fukui

Hiroshi Kobayashi

Kunihiro Ichimura

Minoru Suezaki

Toshio Enami

Tamaki Nakano

Munehiro Hatai

Motohiro Yagi

Takeo Kuroda

Takao Unate

Kenichi Aoki

Masakazu Nakata

Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.

Curable composition for electronic component and connection structure

There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.

Conductive material and connected structure

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

Conductive particles, method for producing conductive particles, conductive material and connection structure

It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Adhesive for electronic components

The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10&#xb0; C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.

Conductive material and connection structure

A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate () with the photosensitive resin composition to thereby form photosensitive resin composition layer () of given thickness; and exposing the photosensitive resin composition layer () selectively through mask () to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (A) furnished on its surface with protrusion/depression pattern.

Process for producing patterned film and photosensitive resin composition

It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa&#xb7;s or less and a viscosity at 10 rpm being 100 Pa&#xb7;s or less, upon being measured at 25&#xb0; C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.

Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device

The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

Adhesive for electronic component

The invention provides compounds which can generate amine by irradiation with light and are excellent both in photodecomposability and in reactivity and compatibility with amine-curable compounds, and photo-setting compositions containing the compounds. The compounds are carbamoyloxyimino compounds represented by the structural formula (I); and the compositions each comprise one or more of the carbamoyloxyimino compounds and an amine-curable compound. In the formula (I), R1 is an n-valent organic group; R2 and R3 are each hydrogen or an aromatic or aliphatic group; and n is an integer of 1 or above.

Photosensitive amine generator, photocurable composition and photoreactive adhesive composition

An acrylic polymer suitable for use as a charge transport material, the acrylic polymer containing pendant &#x3c0;-conjugated groups represented by the following general formula (1) and having a triad syndiotacticity or triad isotacticity of at least 60%:wherein in the formula (1), Ar represents an aromatic group, Rrepresents hydrogen or a methyl group, Rrepresents an organic group or none, Rand Rboth represent hydrogen or at least one of them represents an electron-donating or electron-withdrawing group, and n denotes an integer of 2 or larger.

Acrylic polymer and charge transport material

A photoreactive adhesive composition which is of the one-pack type, has excellent workability, cures upon irradiation with light, and can have sufficient initial adhesion strength and heat resistance immediately after bonding. The photoreactive adhesive composition comprises a urethane prepolymer and a compound which generates an amine upon irradiation with light, wherein the amine-generating compound is a cobalt/amine complex, O-acyloxime, or carbamic acid derivative.

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Osaka, Japan

Hideaki Ishizawa