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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9446484 B1

PDFFull Text
Date of Patent:
Sep. 20, 2016

Filed:

Feb. 19, 2013

Conductive particles, method for producing conductive particles, conductive material and connection structure

Applicant:

Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;

Inventors:

Ryohei Masui, Osaka, JP;

Takashi Kubota, Osaka, JP;

Hideaki Ishizawa, Osaka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Paul McGee, III

Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/36 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01B 1/22 (2006.01); H01R 4/04 (2006.01); B23K 35/365 (2006.01); H01R 12/52 (2011.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 35/365 (2013.01); B23K 35/3612 (2013.01); B23K 35/3618 (2013.01); H01B 1/22 (2013.01); H01R 4/04 (2013.01); H05K 1/0213 (2013.01); H05K 1/0393 (2013.01); H05K 1/095 (2013.01); H05K 1/118 (2013.01); H01R 12/52 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0784 (2013.01);
Abstract

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

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Masui, Ryohei. (2016). Conductive particles, method for producing conductive particles, conductive material and connection structure (U.S. Patent No. 9446484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9446484

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