Osaka, Japan

Ryohei Masui


Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2010-2016

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4 patents (USPTO):Explore Patents

Title: Ryohei Masui: Innovator in Conductive Materials

Introduction

Ryohei Masui is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of conductive materials, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative solutions.

Latest Patents

Masui's latest patents include advancements in conductive particles and adhesives for electronic components. One of his notable inventions is a conductive particle and a conductive material designed to decrease connection resistance and suppress the generation of voids in connection structures. This invention features a solder at a conductive surface, with a carboxyl group covalently bonded to the surface of the solder. Additionally, he has developed an adhesive for electronic components that prevents warpage and reflow cracks, particularly when bonding thin electronic components. This adhesive comprises an epoxy compound with an aliphatic polyether backbone, an epoxy group-containing acrylic polymer, an episulfide compound, and a curing agent.

Career Highlights

Ryohei Masui is currently employed at Sekisui Chemical Co., Ltd., where he continues to innovate in the field of conductive materials. His work has been instrumental in advancing technologies that improve the performance of electronic devices.

Collaborations

Masui has collaborated with notable colleagues, including Hideaki Ishizawa and Akinobu Hayakawa. Their combined expertise has contributed to the successful development of various innovative solutions in the industry.

Conclusion

Ryohei Masui's contributions to the field of conductive materials and electronic components highlight his role as a leading inventor. His innovative patents and collaborations reflect his commitment to advancing technology and improving the reliability of electronic devices.

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