Sekisui Chemical Co., Ltd.

Ryohei Masui

Hideaki Ishizawa

Akinobu Hayakawa

Kohei Takeda

Takashi Kubota

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

Conductive particles, method for producing conductive particles, conductive material and connection structure

It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Adhesive for electronic components

A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

Growing community of inventors

Osaka, Japan

Ryohei Masui