The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Oct. 19, 2006
Hiroji Fukui, Osaka, JP;
Kenichi Aoki, Funabashi, JP;
Kunihiro Ichimura, Yokohama, JP;
Minoru Suezaki, Osaka, JP;
Toshio Enami, Osaka, JP;
Hideaki Ishizawa, Osaka, JP;
Takao Unate, Osaka, JP;
Hiroshi Kobayashi, Osaka, JP;
Hiroji Fukui, Osaka, JP;
Kenichi Aoki, Funabashi, JP;
Kunihiro Ichimura, Yokohama, JP;
Minoru Suezaki, Osaka, JP;
Toshio Enami, Osaka, JP;
Hideaki Ishizawa, Osaka, JP;
Takao Unate, Osaka, JP;
Hiroshi Kobayashi, Osaka, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Abstract
A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate () with the photosensitive resin composition to thereby form photosensitive resin composition layer () of given thickness; and exposing the photosensitive resin composition layer () selectively through mask () to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (A) furnished on its surface with protrusion/depression pattern.