Chadds Ford, PA, United States of America

Heinz F Reinhardt

This inventor holds 17 USPTO granted patents, primarily in Semiconductor Polishing. Top assignees: Rodel Holdings, Inc., Rodel Inc., Rohm and Haas Electronic Materials Cmp Holdings, Inc.. Active years: 1996-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinz F Reinhardt. Retrieved from https://idiyas.com/inventor/heinz-f-reinhardt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 11

Forward Citations = 555(Granted Patents)


Company Filing History:


Years Active: 1996-2007

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Areas of Expertise:
Polishing Compositions
Semiconductor Device
Polishing Pads
Fixed Abrasive System
Polymeric Materials
Mosaic Technology
Hollow Fibers
Planarizing Methods
Polyurethane Pads
Dissolvable Substances
Microelements
17 patents (USPTO):Explore Patents

Title: The Innovations of Heinz F. Reinhardt

Introduction

Heinz F. Reinhardt is a notable inventor based in Chadds Ford, Pennsylvania, with a remarkable portfolio of 17 patents. His work primarily focuses on advancements in polishing compositions and methods, particularly for noble metals and semiconductor devices.

Latest Patents

One of Reinhardt's latest patents is for polishing compositions for noble metals. This invention is particularly useful for chemical-mechanical polishing of substrates containing noble metals such as platinum. The composition includes up to about 50% by weight of an adjuvant, which can be a metal-anion compound, a metal-cation compound, or mixtures thereof. Additionally, it contains abrasive particles ranging from about 0.5% to about 55% by weight, selected from materials like alumina, ceria, and diamond. The inclusion of water-soluble organic additives, up to about 10% by weight, enhances the dispersion of abrasive particles and improves metal removal rates.

Another significant patent involves a method of polishing a semiconductor device. This method utilizes a polishing pad made of a polymeric matrix and a dissolvable substance. The dissolvable substance is strategically located at the work surface and subsurface of the polishing pad. As the semiconductor device is polished, the dissolvable substance dissolves, allowing the subsurface to become a new work surface, thereby continuing the polishing process effectively.

Career Highlights

Reinhardt has had a distinguished career, working with prominent companies such as Rodel Holdings, Inc. and Rodel Inc. His contributions to the field of polishing technologies have been instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Reinhardt has collaborated with notable individuals, including William D. Budinger and David B. James. These collaborations have likely contributed to the innovative developments in his patents and the overall advancement of polishing technologies.

Conclusion

Heinz F. Reinhardt's contributions to the field of polishing compositions and methods have significantly impacted the semiconductor and noble metal industries. His innovative patents reflect a deep understanding of materials and processes, showcasing his expertise as an inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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