The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Nov. 12, 2002
Applicants:
Heinz F. Reinhardt, Chadds Ford, PA (US);
John V. H. Roberts, Newark, DE (US);
Harry George Mcclain, Middletown, DE (US);
William D. Budinger, Newark, DE (US);
Elmer William Jensen, New Castle, DE (US);
Inventors:
Heinz F. Reinhardt, Chadds Ford, PA (US);
John V. H. Roberts, Newark, DE (US);
Harry George McClain, Middletown, DE (US);
William D. Budinger, Newark, DE (US);
Elmer William Jensen, New Castle, DE (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington, DE (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D011/00 ;
U.S. Cl.
CPC ...
Abstract
A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.