The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
May. 19, 2004
Heinz F. Reinhardt, Chadds Ford, PA (US);
John V. H. Roberts, Newark, DE (US);
Harry George Mcclain, Middletown, DE (US);
William D. Budinger, Newark, DE (US);
Elmer William Jensen, New Castle, DE (US);
Heinz F. Reinhardt, Chadds Ford, PA (US);
John V. H. Roberts, Newark, DE (US);
Harry George McClain, Middletown, DE (US);
William D. Budinger, Newark, DE (US);
Elmer William Jensen, New Castle, DE (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington, DE (US);
Abstract
The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.