Heidi Lan

Title: The Innovative Contributions of Heidi Lan

Introduction

Heidi Lan is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of wafer processing and device chip manufacturing. With a total of 6 patents to her name, her work has advanced the technology used in semiconductor fabrication.

Latest Patents

Heidi Lan's latest patents include a wafer processing method and a manufacturing method for device chips. The wafer processing method involves a series of steps to process a wafer that includes devices on its front surface. This method features a protective component formed of resin that softens with heat, which is applied to the front surface of the wafer. The process includes measuring the thickness of the protective component and grinding the back surface of the wafer to achieve the desired thickness.

The manufacturing method for device chips consists of several steps, including supplying a die bonding resin to the back surface of a wafer and solidifying it. This is followed by covering the resin with a water-soluble resin, applying a laser beam to remove both resins, etching the exposed portion of the wafer, and finally removing the water-soluble resin with water.

Career Highlights

Heidi has worked with notable companies such as Disco Corporation, where she has honed her skills in semiconductor technology. Her innovative approaches have led to advancements in the efficiency and effectiveness of wafer processing techniques.

Collaborations

Throughout her career, Heidi has collaborated with talented individuals, including Kentaro Odanaka and Masatoshi Wakahara. These collaborations have contributed to her success and the development of her patented technologies.

Conclusion

Heidi Lan's contributions to the field of semiconductor technology through her innovative patents and collaborations highlight her role as a leading inventor. Her work continues to influence the industry and pave the way for future advancements.