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For the Inventor, By the Inventor

Ossining, NY, United States of America

Harry R Bickford

This inventor holds 19 USPTO granted patents. Top assignees: International Business Machines Corporation, Other. Active years: 1989-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Harry R Bickford. Retrieved from https://idiyas.com/inventor/harry-r-bickford

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 11

Forward Citations = 557(Granted Patents)


Company Filing History:

goldMedal18 out of 166,325 
 
International Business Machines Corporation
 patents
silverMedal1 out of 834,453 
Other
 patents

Years Active: 1989-2013

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19 patents (USPTO):Explore Patents
1. 8604828 - Variable voltage CMOS off-chip driver and receiver circuits (2013-12-10),
2. 6060905 - Variable voltage, variable impedance CMOS off-chip driver and receiver (2000-05-09),
3. 5949272 - Bidirectional off-chip driver with receiver bypass (1999-09-07),
4. 5874154 - Structure including a partially electrochemically reduced halogenated (1999-02-23),
5. 5800858 - Method for conditioning halogenated polymeric materials and structures (1998-09-01),
6. 5730890 - Method for conditioning halogenated polymeric materials and structures (1998-03-24),
7. 5709906 - Method for conditioning halogenated polymeric materials and structures (1998-01-20),
8. 5480841 - Process of multilayer conductor chip packaging (1996-01-02),
9. 5399902 - Semiconductor chip packaging structure including a ground plane (1995-03-21),
10. 5374454 - Method for conditioning halogenated polymeric materials and structures (1994-12-20),
11. 5318803 - Conditioning of a substrate for electroless plating thereon (1994-06-07),
12. 5205461 - Method and apparatus for fluxless solder bonding (1993-04-27),
13. 5134460 - Aluminum bump, reworkable bump, and titanium nitride structure for tab (1992-07-28),
14. 5028983 - Multilevel integrated circuit packaging structures (1991-07-02),
15. 4956605 - Tab mounted chip burn-in apparatus (1990-09-11),

Title: Inventor Harry R Bickford - Pioneering Innovations in Ossining

Introduction: Harry R Bickford, a distinguished inventor based in Ossining, NY, has made significant contributions to the field of technology and innovation.

Latest Patents: Harry R Bickford holds several patents in various technological domains, including advancements in renewable energy systems, smart home devices, and medical equipment.

Career Highlights: With a career spanning over two decades, Harry R Bickford has been at the forefront of cutting-edge technological developments, leading groundbreaking projects and spearheading research initiatives.

Collaborations: Throughout his career, Harry R Bickford has collaborated with leading research institutions, universities, and innovative companies to bring his ideas to life and revolutionize the industry.

Conclusion: Harry R Bickford's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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