The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 1998

Filed:

Jun. 16, 1995
Applicant:
Inventors:

Harry Randall Bickford, Ossining, NY (US);

Peter J Duke, Endwell, NY (US);

Elizabeth Foster, Friendsville, PA (US);

Martin Goldberg, San Jose, CA (US);

Voya Rista Markovich, Endwell, NY (US);

Linda Matthew, Palo Alto, CA (US);

Donald G McBride, Binghamton, NY (US);

Terrence Robert O'Toole, Webster, NY (US);

Stephen Leo Tisdale, Endwell, NY (US);

Alfred Viehbeck, Fishkill, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427306 ; 427301 ; 427282 ; 427336 ; 204131 ;
Abstract

A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent. The treated substrate is contacted with a material to promote adhesion of the material to the treated surface.


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