Friendsville, PA, United States of America

Elizabeth F Foster


Average Co-Inventor Count = 5.9

ph-index = 10

Forward Citations = 349(Granted Patents)


Company Filing History:


Years Active: 1992-2008

where 'Filed Patents' based on already Granted Patents

29 patents (USPTO):

Title: **Innovations of Elizabeth F Foster: A Trailblazing Inventor in Electronics**

Introduction

Elizabeth F Foster, an accomplished inventor based in Friendsville, PA, has made remarkable contributions to the field of electronics, holding a total of 29 patents. Her innovative work centers around advanced electronic packaging and substrate technologies, setting her apart as a leading figure in her domain.

Latest Patents

Among Foster's latest patents is the innovative design of a circuitized substrate with conductive polymer and seed material adhesion layer. This patent outlines a method for creating a circuitized substrate, such as a laminate chip carrier, utilizing a polymer like Teflon as a dielectric layer. By implementing a promotion adhesion layer of polymer, Foster's approach ensures that a conductive layer adheres securely through plating. This method enables the production of extremely narrow conductive pathways for connections to semiconductor chips, leveraging electroless plating techniques.

Another cornerstone of her patent portfolio is the development of an electronic package with filled blind vias. This invention enhances both the density of electronic packaging and the electrical reliability of sub-assemblies using stacked blind vias. By introducing a blind, landless via in a dielectric layer laminated to a conductive metal core, Foster's design allows for efficient electro-deposition of metals, such as copper, while aligning second layer blind vias for multi-layered assembly, showcasing her adeptness at tackling complex engineering challenges in electronic design.

Career Highlights

Foster has been affiliated with prestigious companies, including the International Business Machines Corporation (IBM) and Endicott Interconnect Technologies, Inc. During her tenure at these organizations, she has played a pivotal role in driving innovation and advancing technology in the field of electronic components.

Collaborations

Throughout her career, Foster has collaborated with talented engineers like Stephen L Tisdale and Alfred Viehbeck. These partnerships have been instrumental in enriching her work, driving innovative solutions that enhance the effectiveness of electronic packaging.

Conclusion

With an impressive portfolio of patents and significant contributions to electronics, Elizabeth F Foster stands out as a pioneering inventor. Her innovative work continues to influence the industry, paving the way for future advancements in electronic packaging and circuit design. Foster's commitment to engineering excellence serves as an inspiration for aspiring inventors in the field.

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