The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1991
Filed:
Oct. 27, 1988
Harry R Bickford, Ossining, NY (US);
Mark F Bregman, Ridgefield, CT (US);
Thomas M Cipolla, Hopewell Junction, NY (US);
John Gow, III, Milton, VT (US);
Peter G Ledermann, Pleasantville, NY (US);
Ekkehard F Miersch, Mamaroneck, NY (US);
Leonard T Olson, Centerville, VA (US);
David P Pagnani, Apalachin, NY (US);
Timothy C Reiley, Los Gatos, CA (US);
Uh-Po E Tsou, Essex Junction, VT (US);
Walter V Vilkelis, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Electronic device packaging structures useful for electrically interconnecting an electronic device to a substrate. The structure contains at least two metallization layers with dielectric layers between adjacent to metallization layers. The dielectric layers can have variable thickness. Beam leads can project inwardly in cantilevered fashion over a central aperture through the dielectric layers. The inner ends of the beam leads lie substantially in one plane and can be bonded to contact pads on integrated circuit electronic devices. Beam leads can project outwardly from the metallization layers over outer edges of the dielectric layers for bonding to contact pads on a substrate. Signal leads on metallization layers can be symmetrically arranged between ground and voltage leads to provide optimal impedance properties. These structures are useful for tape automated bonding applications.