Uh-Po E Tsou

Title: Innovations of Uh-Po E Tsou in Electronic Device Packaging

Introduction

Uh-Po E Tsou is a notable inventor based in Essex Junction, VT (US). He has made significant contributions to the field of electronic device packaging. His innovative work has led to the development of advanced packaging structures that enhance the performance and reliability of electronic devices.

Latest Patents

Uh-Po E Tsou holds a patent for "Multilevel integrated circuit packaging structures." This invention focuses on electronic device packaging structures that are useful for electrically interconnecting an electronic device to a substrate. The structure features at least two metallization layers with dielectric layers positioned between adjacent metallization layers. The dielectric layers can vary in thickness, allowing for flexibility in design. Beam leads can project inwardly in a cantilevered fashion over a central aperture through the dielectric layers. The inner ends of the beam leads lie substantially in one plane and can be bonded to contact pads on integrated circuit electronic devices. Additionally, beam leads can extend outwardly from the metallization layers over the outer edges of the dielectric layers for bonding to contact pads on a substrate. The arrangement of signal leads on metallization layers is symmetrically designed between ground and voltage leads to provide optimal impedance properties. These structures are particularly useful for tape automated bonding applications.

Career Highlights

Uh-Po E Tsou is associated with the International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His work has been instrumental in advancing electronic packaging technologies, which are critical for modern electronic devices.

Collaborations

Throughout his career, Uh-Po E Tsou has collaborated with notable colleagues, including Harry R Bickford and Mark F Bregman. These collaborations have fostered an environment of innovation and have led to significant advancements in the field.

Conclusion

Uh-Po E Tsou's contributions to electronic device packaging have paved the way for improved technologies in the industry. His innovative patent and collaborations highlight his role as a key figure in advancing electronic packaging solutions.