Chino Hills, CA, United States of America

Hao Tang


 

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • San Diego, CA (US) (2019)
  • Chino Hills, CA (US) (2018 - 2021)

Company Filing History:


Years Active: 2018-2021

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4 patents (USPTO):Explore Patents

Title: The Innovative Mind of Hao Tang: Pioneering Wafer De-bonding Technology

Introduction: Hao Tang, an accomplished inventor based in San Diego, California, has made notable contributions to the field of semiconductor technology. With one patent to his name, he has demonstrated a keen ability to innovate within the industry, particularly in developing efficient tools for wafer processing.

Latest Patents: Hao Tang's significant patent, titled "Wafer De-bonding Device," exemplifies his inventive spirit. This device is designed to simplify the process of de-bonding device wafers and carrier wafers that are bonded together. The innovation includes a stage for holding the wafers and a specialized tool equipped with a gas outlet, which operates in proximity to the stage. This tool has an adjustment device that allows for precise movement toward or away from the stage. A notable feature is the bit that cuts a notch into the film or adhesive layer at the junction of the bonded wafers. The device also utilizes a gas jet generator to direct a gas jet precisely at the junction of the bonded wafers, highlighting a high degree of automation and ease of operation.

Career Highlights: Hao Tang is currently associated with Zhejiang Microtech Material Co., Ltd., a company known for its advancements in microelectronics and material technology. His role within the company involves pushing the boundaries of existing technologies and developing novel solutions to enhance wafer fabrication processes.

Collaborations: In his professional journey, Hao collaborates closely with Ming Yin, a coworker who shares his dedication to innovation. Together, they strive to advance the capabilities of wafer technology and contribute to the evolution of the semiconductor industry.

Conclusion: As an inventor, Hao Tang's work on the Wafer De-bonding Device reveals his passion for innovation and problem-solving within the semiconductor space. His contributions not only demonstrate his technical skill but also pave the way for greater efficiency and automation in wafer processing, ensuring a lasting impact on the industry.

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