The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Jul. 11, 2015
Applicants:
Hao Tang, Chino Hills, CA (US);
Yushen Zeng, Ningbo, CN;
Inventors:
Hao Tang, Chino Hills, CA (US);
Yushen Zeng, Ningbo, CN;
Assignee:
Micro Materials Inc., Camarillo, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 38/10 (2013.01); H01L 21/67092 (2013.01); B32B 37/06 (2013.01); B32B 2457/14 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1116 (2015.01); Y10T 156/1137 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1939 (2015.01); Y10T 156/1967 (2015.01);
Abstract
The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.