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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10204813 B1

PDFFull Text
Date of Patent:
Feb. 12, 2019

Filed:

Jul. 16, 2015

Wafer de-bonding device

Applicant:

Zhejiang Microtech Material Co., Ltd., Zhejiang, CN;

Inventors:

Ming Yin, Zhejiang, CN;

Hao Tang, San Diego, CA (US);

Assignee:

Zhejiang Microtech Material Co., Ltd., Zhejiang, CN;

Attorneys:

Radlo IP Law Group

Peter Su

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 43/006 (2013.01); H01L 21/67 (2013.01); H01L 21/67017 (2013.01); H01L 21/67092 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01L 21/6838 (2013.01); H01L 21/68714 (2013.01); B32B 38/10 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1137 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1939 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1961 (2015.01); Y10T 156/1967 (2015.01);
Abstract

A wafer de-bonding device comprises a stage () for holding a device wafer and a carrier wafer bonded together, and a tool () with a gas outlet () disposed in proximity to the stage () through an adjustment device for control the tool () to move towards or away from the stage (), the tool () being provided with a bit () to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet () being provided on the tool bit (), the tool () being further provided with a gas inlet () in communication with the gas outlet (), the gas inlet () being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (). The wafer de-bonding device has a high degree of automation and simple operations.

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