Zhejiang, China

Ming Yin


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Ming Yin

Introduction

Ming Yin is a notable inventor based in Zhejiang, China. He has made significant strides in the field of technology, particularly with his innovative designs and patents. His work focuses on enhancing the efficiency and automation of various devices.

Latest Patents

Ming Yin holds a patent for a wafer de-bonding device. This device comprises a stage for holding a device wafer and a carrier wafer that are bonded together. It features a tool with a gas outlet positioned near the stage, which can be adjusted to move towards or away from the stage. The tool is equipped with a bit designed to cut a notch into a film or adhesive layer at the junction of the bonded wafers. The gas outlet on the tool bit is connected to a gas jet generator, allowing for the directed application of a gas jet towards the junction of the bonded wafers. This wafer de-bonding device is characterized by a high degree of automation and simple operations. Ming Yin has 1 patent to his name.

Career Highlights

Ming Yin is currently associated with Zhejiang Microtech Material Co., Ltd. His role in the company has allowed him to contribute to advancements in material technology and device automation. His innovative approach has positioned him as a key figure in his field.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Ming Yin's contributions to the field of technology, particularly through his patented wafer de-bonding device, highlight his innovative spirit and dedication to advancing automation in device handling. His work continues to influence the industry positively.

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