The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Jul. 11, 2015
Applicants:
Hao Tang, Chino Hills, CA (US);
Zhoujie Zhang, Ningbo, CN;
Inventors:
Hao Tang, Chino Hills, CA (US);
Zhoujie Zhang, Ningbo, CN;
Assignee:
Micro Materials Inc., Camarillo, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B05D 1/28 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); B05D 1/30 (2006.01); B05D 1/32 (2006.01); B05D 1/00 (2006.01); H01L 21/683 (2006.01); H01L 23/15 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B05D 1/28 (2013.01); B05D 1/005 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/30 (2013.01); B05D 1/32 (2013.01); H01L 21/6835 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 23/15 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1116 (2015.01); Y10T 156/1137 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1939 (2015.01); Y10T 156/1967 (2015.01);
Abstract
The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.