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For the Inventor, By the Inventor

Suwon-si, South Korea

Hak-Sun Lee

USPTO Granted Patents = 10

Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 40(Granted Patents)


Company Filing History:

goldMedal10 out of 131,766 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2009-2024

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10 patents (USPTO):Explore Patents
1. 11876017 - Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same (2024-01-16),
2. 11232986 - Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same (2022-01-25),
3. 10600653 - Method for forming a fine pattern (2020-03-24),
4. 10186485 - Planarized interlayer dielectric with air gap isolation (2019-01-22),
5. 9929099 - Planarized interlayer dielectric with air gap isolation (2018-03-27),
6. 9312181 - Semiconductor device, electronic device including the same and manufacturing methods thereof (2016-04-12),
7. 7998874 - Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the same (2011-08-16),
8. 7935635 - Method of forming fine patterns of semiconductor devices using double patterning (2011-05-03),
9. 7576010 - Method of forming pattern using fine pitch hard mask (2009-08-18),
10. 7550391 - Method for forming fine patterns of a semiconductor device using double patterning (2009-06-23),

Title: **Innovator Spotlight: Hak-Sun Lee**

Introduction

Hak-Sun Lee, an accomplished inventor based in Suwon-si, South Korea, holds an impressive portfolio of 10 patents. His work primarily focuses on the advancement of integrated circuit devices, where he has made significant contributions to improving electronic technologies.

Latest Patents

Among his latest inventions is a groundbreaking patent for integrated circuit devices that include enlarged vias and fully aligned metal wires. This innovative method of forming integrated circuit devices incorporates a first insulating layer alongside a via contact situated on a substrate. The substrate is designed with an upper surface facing the via contact, while the via contact resides within the first insulating layer, featuring distinct surfaces that engage with the substrate. The process further entails creating a second insulating layer and integrating a metallic wire upon the via contact, enhancing the overall functionality and efficiency of the integrated circuit devices.

Career Highlights

Hak-Sun Lee's career is marked by his tenure at Samsung Electronics Co., Ltd., where he leverages his expertise in the field to drive forward innovations in technology. His commitment to research and development has positioned him as a key figure in the advancement of integrated circuit technologies, contributing to the company's reputation as a leader in the electronics industry.

Collaborations

Throughout his career, Hak-Sun Lee has collaborated with notable coworkers such as Kyung-Yub Jeon and Myeong-Cheol Kim. These partnerships have fostered an environment of creativity and innovation, enabling them to push the boundaries of technology and develop cutting-edge solutions in integrated circuit design.

Conclusion

Hak-Sun Lee's contributions to the field of integrated circuits reflect his dedication to innovation and the advancement of technology. His patents serve as a testament to his vision and expertise, solidifying his position as a prominent inventor in the realm of electronics. As the industry continues to evolve, Lee's work will undoubtedly play a vital role in shaping the future of integrated circuit devices.

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